A Review: Combination of Fungicide, Polymer Coating and Packaging Materials on Improve Germination Rate and Improve Uniformity of Seedling Emergence of Different Seeds during Storage

Mishra, S. N. and Singh, Shraddha and Para, P. K. and Sharma, Lakki and Bhandari, V. V. Singh (2023) A Review: Combination of Fungicide, Polymer Coating and Packaging Materials on Improve Germination Rate and Improve Uniformity of Seedling Emergence of Different Seeds during Storage. International Journal of Environment and Climate Change, 13 (8). pp. 2142-2157. ISSN 2581-8627

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Abstract

Seed coating is a method of encasing seeds in adhesive materials to improve germination and performance while lowering cost. Seed coating has been widely used in agriculture as an efficient way to reduce biotic and abiotic stressors, hence boosting crop growth, productivity, and health, in order to satisfy the demands of the development of precision agriculture. Plant-beneficial microorganisms include Trichoderma, rhizobium, arbuscular mycorrhizal fungusfungi and plant growth-promoting bacteria. Fungicide seed treatment is easy, affordable, and efficient. Additionally, it is well known that the selection of chemicals for seed treatment also has a favourable impact on seed viability and vigour during germination storage. Seed coating polymers are utilised in conjunction with active components like fungicides and insecticides. A new era of biocontrol techniques has recently begun. By utilising hostile microbes to fight seed-borne illnesses, new technology is being developed. Beneficial fungus like Trichoderma harzianum and Trichoderma viride are among the bioagents most powerful and efficient fungus- and soil-borne pathogen suppressants such as seedling blight, collar rot, stem rot, root rot, dry root rot, and their use may can effectively manage each of these illnesses, and thus encourage crop growth and yield.

Item Type: Article
Subjects: STM Article > Geological Science
Depositing User: Unnamed user with email support@stmarticle.org
Date Deposited: 23 Jun 2023 06:56
Last Modified: 04 Apr 2024 09:32
URI: http://publish.journalgazett.co.in/id/eprint/1662

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